Cutting accuracy is ±0.01mm! We can also handle strip cutting, individual piece cutting, deep groove processing, and wide groove cutting.
Cutting processing is a method of cutting and shaping the target object, and by selecting the appropriate method, high precision processing can be achieved. "Slicer cutting processing" involves bonding with WAX suitable for the product and processing conditions, allowing for strip cutting, individual piece cutting, deep groove processing, and wide groove cutting to match patterns and product edges. The main processing materials include alumina, aluminum nitride, piezoelectric ceramics, and glass materials. 【Work Size】 ■ Maximum: 250×160×15.0mm ■ Minimum cutting dimension: 0.5mm ■ Deep groove specification slicer: t40.0mm, groove depth up to 35.0mm ■ Cutting precision: ±0.01mm～ *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Equipment Owned】 ■High-Precision Slicer - Capable of high-precision cutting groove processing tailored to patterns and product edges - Multi-blade configuration possible to match product pitch ■Deep Groove Specification Slicer - Blade size can be increased to accommodate 10mm wide grooves and 35mm deep groove processing *For more details, please refer to the PDF document or feel free to contact us.
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Main processing materials: ■ Alumina, aluminum nitride, glass materials, piezoelectric ceramics *For more details, please refer to the PDF document or feel free to contact us.*
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Company information
Shinko Co., Ltd. is a company located in Uonuma City, Niigata Prefecture, engaged in material development, precision processing of hard materials, and inspection contract services. Our company has been certified by Mitsuke City as a "Mitsuke SDGs Partner," a business or organization promoting SDGs together with Mitsuke City. With our capability to respond from prototyping to mass production and our high-precision processing technology, we meet various needs such as new product development, and we can provide integrated production support from material manufacturing to thin film microprocessing. We also accommodate a wide range of processes, from material manufacturing and fine processing to photolithography and inspection services.