By automating the peeling process of various protective films for inline-produced package substrates and automotive substrates, it is possible to reduce labor and improve productivity.
【Product Features】 ○ Clean Release By eliminating the use of air blow, chip flying can be reduced to create a release trigger. ○ No Setup Required No need for setup changes based on the thickness and size of the substrate. ○ Compatible with Ultra-Thin Substrates (Material Thickness: 0.025mm) Equipped with substrate clamps, it can handle ultra-thin plates that were difficult to release with conventional equipment. ○ Compatible with Difficult-to-Release Materials Please consult us regarding difficult-to-release materials such as ABF for PKG substrates and solder resist. ○ Built-in NG Stocker Film remnants are automatically detected by sensors and stored in the NG stocker. ○ Clean Specification Support (Additional Option) Downflow using HEPA filters is also possible. We can conduct release tests with demo machines and consider special support for thin substrates, large substrates, and special films, so please feel free to contact us.
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basic information
【Standard Specifications】 ■ Minimum Board Thickness: Base Material: 0.025mm or more Copper Foil: 9μm or more on one side (both sides required) ■ Maximum Board Thickness: 3.2mm (including copper foil and DF) ■ Applicable Board Size: MAX 650×650mm~ (Width × Length) MIN 300×250mm ■ Cycle Time: 15 seconds per sheet ■ Peeling Method: Adhesive Roller ■ Auxiliary Peeling Method: Horizontal Moving Nozzle ■ Power Supply: Three-phase 200/220VAC 50/60Hz ■ Weight (Main Unit): 500kg
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Applications/Examples of results
Peeling off various protective films such as package substrates and automotive substrates.
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Company information
Adtech Engineering has been providing various devices necessary for manufacturing processes by utilizing a combination of ultra-precision machining technology and FA (Factory Automation) equipment development technology, along with integrated technologies such as optics, software, alignment, and control/analysis. In recent years, we have strengthened our position as a solution-oriented company, focusing particularly on problem-solving in the exposure process. The electronics-related equipment business is characterized by rapid fluctuations and fast technological advancements. In this dynamic market, we aim to optimize and enhance manufacturing processes by offering innovative technologies and solutions. By connecting and further expanding the technical expertise cultivated in each business with diverse applications, our solutions become increasingly robust and diverse, and through continuous innovation, we will continue to build the future of the digital society together with our customers.
![Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].](https://image.mono.ipros.com/public/product/image/1ab/2001482620/IPROS9539451614471571514.jpg?w=280&h=280)
