Wafer automatic peeling device (peeling and cleaning machine)

PHT will operate globally as a niche top company in the semiconductor industry, specializing in wafer automatic peeling devices (peeling and cleaning machines).

This is an automatic wafer detaching device after wire sawing (slicing). By setting the ingot adhered to the plate jig on the input side, the system performs everything from rough cleaning to wafer detachment, wafer single-sheet cleaning, drying, and cassette storage automatically. The plate jig after detachment is discharged to the unloader side. Detachment is done using a hot air heating method, one piece at a time. The wafers after detachment undergo single-sheet cleaning. After high-pressure cleaning with two fluids, scrub cleaning, rinse cleaning, and drying with suction rollers, they are stored one by one in the cassette at the unloader section using a horizontal multi-joint robot. Storage can be selected from the upper or lower section of the cassette (which holds 25 pieces). A maximum of 6 storage cassettes can be accommodated. It is compatible with OHT transport.

Wafer processing/polishing equipment