PHT will operate globally as a niche top company in the semiconductor industry, specializing in wafer automatic peeling devices (peeling and cleaning machines).
This is an automatic wafer detaching device after wire sawing (slicing). By setting the ingot adhered to the plate jig on the input side, the system performs everything from rough cleaning to wafer detachment, wafer single-sheet cleaning, drying, and cassette storage automatically. The plate jig after detachment is discharged to the unloader side. Detachment is done using a hot air heating method, one piece at a time. The wafers after detachment undergo single-sheet cleaning. After high-pressure cleaning with two fluids, scrub cleaning, rinse cleaning, and drying with suction rollers, they are stored one by one in the cassette at the unloader section using a horizontal multi-joint robot. Storage can be selected from the upper or lower section of the cassette (which holds 25 pieces). A maximum of 6 storage cassettes can be accommodated. It is compatible with OHT transport.
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basic information
■Features - Slide mechanism with unique control. - Automation of the cleaning process after wafer separation, which was previously difficult. - Fully automated process from cleaning the wafers cut by a wire saw after separation from the beam to storing them in a cassette. - Achieves low running costs. - Customizable design to fit your ingot lifter. - Option to add a loader ID reader. - Option to add RFID functionality to the unloader carrier section.
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Applications/Examples of results
【Case Studies】 ■Automation of Manual Stripping ■Wafer Information Management *For more details, please refer to the PDF document or feel free to contact us.
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Company information
PHT Corporation is a company engaged in the semiconductor transport system business and semiconductor cleaning equipment business. Features PHT will actively operate globally as a niche top company in the semiconductor industry, specializing in wafer automatic peeling equipment (peeling cleaning machines). PHT has proposed transport and cleaning solutions for compound semiconductors, including next-generation SiC (silicon carbide) and GaN (gallium nitride) materials, utilizing silicon wafer transport and laser processing technology. We are particularly proactive in approaching the power semiconductor market. Our company is creating a comprehensive solution provision system for semiconductor manufacturing equipment aimed at energy conservation (electric vehicles, power control).
