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Industrial Machinery
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PHT

addressTokyo/Kita-ku/2-69-2 Akabane
phone03-6751-7153
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last updated:Mar 12, 2024
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Silicon wafer batch-type automatic cleaning device

Providing suitable custom equipment tailored to your needs! Design capable of process optimization.

This product is a batch-type automatic cleaning device for silicon wafers that achieves an optimal process with a simple processing structure. The arrangement of parts takes maintenance into consideration. Each unit of the cleaning device is modularized. It supports various processes such as "post-wire saw cleaning," "post-lapping cleaning," and "alkaline etching cleaning." 【Features】 ■ High process performance ■ High throughput ■ Improved maintainability ■ Equipment design ■ Extensive track record *For more details, please refer to the PDF materials or feel free to contact us.

  • Other cleaning machines

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Wafer Cassette Changer 'PCT2022'

Dicing frame sizes 200mm and 300mm. Takt time and transport time are 180 seconds for 13 pieces or less.

The "PCT2022" is a wafer cassette changer that replaces the dicing frames for 200mm and 300mm stored in a designated cassette with a standard cassette. The cassettes used are the 6-piece cassette and the 13-piece cassette. Each cassette is supplied to the stage by the operator. Please feel free to contact us for inquiries. 【Device Specifications (Excerpt)】 ■ Dicing Frame - Size: 200mm/300mm - Thickness: 1.22±0.08mm ■ Carrier - Standard cassette (6-piece cassette, 13-piece cassette) - Frame storage pitch (15mm) *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Wafer automatic peeling device (peeling and cleaning machine)

PHT will operate globally as a niche top company in the semiconductor industry, specializing in wafer automatic peeling devices (peeling and cleaning machines).

This is an automatic wafer detaching device after wire sawing (slicing). By setting the ingot adhered to the plate jig on the input side, the system performs everything from rough cleaning to wafer detachment, wafer single-sheet cleaning, drying, and cassette storage automatically. The plate jig after detachment is discharged to the unloader side. Detachment is done using a hot air heating method, one piece at a time. The wafers after detachment undergo single-sheet cleaning. After high-pressure cleaning with two fluids, scrub cleaning, rinse cleaning, and drying with suction rollers, they are stored one by one in the cassette at the unloader section using a horizontal multi-joint robot. Storage can be selected from the upper or lower section of the cassette (which holds 25 pieces). A maximum of 6 storage cassettes can be accommodated. It is compatible with OHT transport.

  • Wafer processing/polishing equipment

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EFEM Sota "TYK2102-2"

It is a wafer automatic transfer device that transfers wafers to process and detection modules via a robot in a clean environment.

Equipped with a high-performance AC servo motor, it achieves high-speed transport with a generous load capacity. It allows for optimal placement of robots, load ports, and hands. It inherits over 20 years of robot technology operating in harsh environments. 【Features】 ■ Capable of mounting 1 or 2 aligners, enabling high throughput ■ Various variations and custom options available ■ Compatible with both 200mm and 300mm *For more details, please refer to the PDF document or feel free to contact us.

  • Substrate transport device (loader/unloader)

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Quartz glass wafer transfer device

Auto door FOSB, compatible with carriers such as FOUP! A system that automatically transfers single sheets.

This product is a system that automatically transfers φ300mm (12") quartz glass wafers one by one between carriers from Stage 1 to Stage 2. The takt time and transfer time is 6 minutes and 30 seconds for 25 wafers or less. Regarding the wafer transfer specifications, the basic setup is to remove from the bottom of the cassette and store in the upper section. [Specifications (excerpt)] ■ Stage 1 (Loader) - Stage on the left side of the front of the device - Compatible carriers: Auto Door FOSB (wafer storage pitch 10mm × 25 wafers) FOUP SEMI standard products (wafer storage pitch 10mm × 25 wafers) - Sensor function: A transmissive mapping sensor is installed to confirm the presence of wafers in the cassette. *For more details, please refer to the PDF document or feel free to contact us.

  • Transport and handling robots

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Wafer transport device "PWT2020"

Transport in units of 5 sheets and 25 sheets is also possible! Equipped with error prevention sensors and an emergency stop button.

The "PWT2020" is a wafer transport device that utilizes clean robots. It minimizes contact with the cassette when lifting wafers for loading/unloading, preventing wear, dust generation, and damage to the wafer edges. Through wafer mapping, it detects loading errors such as misalignment and double stacking of wafers. 【Features】 ■ Space-saving ■ Static electricity countermeasure ■ Error monitoring with optical and mechanical sensors ■ Equipped with mapping sensors ■ Compatible with FOUP, FOSB, and H-Square metal cassettes ■ Suitable for Class 10 clean rooms *For more details, please refer to the PDF materials or feel free to contact us.

  • Substrate transport device (loader/unloader)

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Cylindrical Coordinate Clean Robot "PHT-R-4"

Supports atmospheric transport of wafers! The main unit weighs approximately 47 kg and the controller weighs about 8 kg.

The "PHT-R-4" is a horizontal multi-joint wafer transport robot designed for use in clean rooms. It is capable of moving in the front and back (X-axis), rotating (θ-axis), moving up and down (Z-axis), and hand rotation (0 to 180 degrees), making it suitable for transporting wafers in the atmosphere. The drive motor is an AC servo motor with absolute encoder specifications for all axes. 【Product Overview (Excerpt)】 ■ Installation Environment: Inside clean rooms (ambient temperature 10 to 35 degrees, humidity below 70% RH) ■ Arm: Single arm (Material: Aluminum, CFRP, Ceramic) ■ Load Capacity: 3 kg (total weight of hand base, hand, and work) *For more details, please refer to the PDF document or feel free to contact us.

  • Transport and handling robots

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