Transport in units of 5 sheets and 25 sheets is also possible! Equipped with error prevention sensors and an emergency stop button.
The "PWT2020" is a wafer transport device that utilizes clean robots. It minimizes contact with the cassette when lifting wafers for loading/unloading, preventing wear, dust generation, and damage to the wafer edges. Through wafer mapping, it detects loading errors such as misalignment and double stacking of wafers. 【Features】 ■ Space-saving ■ Static electricity countermeasure ■ Error monitoring with optical and mechanical sensors ■ Equipped with mapping sensors ■ Compatible with FOUP, FOSB, and H-Square metal cassettes ■ Suitable for Class 10 clean rooms *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Case Study】 ■Want to transport wafers simply ■Want to reduce friction of workpieces inside the cassette *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Usage】 ■ Cases used by equipment manufacturers - Evaluation wafers are provided by the device manufacturer in FOSB (shipping case). - Transfer to carriers (e.g., FOUP) used in the equipment manufacturer's system. - Transfer wafers after evaluation back to FOSB (for return to the device manufacturer). ■ Cases used by wafer manufacturers - Transfer completed wafers (after final cleaning and inspection) to FOSB (shipping case). - Transfer to PFA carriers (cleaning carriers) between processes (e.g., cleaning processes). *For more details, please refer to the PDF document or feel free to contact us.
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Company information
PHT Corporation is a company engaged in the semiconductor transport system business and semiconductor cleaning equipment business. Features PHT will actively operate globally as a niche top company in the semiconductor industry, specializing in wafer automatic peeling equipment (peeling cleaning machines). PHT has proposed transport and cleaning solutions for compound semiconductors, including next-generation SiC (silicon carbide) and GaN (gallium nitride) materials, utilizing silicon wafer transport and laser processing technology. We are particularly proactive in approaching the power semiconductor market. Our company is creating a comprehensive solution provision system for semiconductor manufacturing equipment aimed at energy conservation (electric vehicles, power control).
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