Auto door FOSB, compatible with carriers such as FOUP! A system that automatically transfers single sheets.
This product is a system that automatically transfers φ300mm (12") quartz glass wafers one by one between carriers from Stage 1 to Stage 2. The takt time and transfer time is 6 minutes and 30 seconds for 25 wafers or less. Regarding the wafer transfer specifications, the basic setup is to remove from the bottom of the cassette and store in the upper section. [Specifications (excerpt)] ■ Stage 1 (Loader) - Stage on the left side of the front of the device - Compatible carriers: Auto Door FOSB (wafer storage pitch 10mm × 25 wafers) FOUP SEMI standard products (wafer storage pitch 10mm × 25 wafers) - Sensor function: A transmissive mapping sensor is installed to confirm the presence of wafers in the cassette. *For more details, please refer to the PDF document or feel free to contact us.
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【Other Specifications (Excerpt)】 ■ Stage 2 (Unloader) - Stage on the right side of the device front - Compatible carriers: Auto Door FOSB (Wafer storage pitch 10mm × 25 pieces) FOUP SEMI standard product (Wafer storage pitch 10mm × 25 pieces) - Sensor function: Installed a transmissive mapping sensor for confirming the presence of wafers in the cassette *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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PHT Corporation is a company engaged in the semiconductor transport system business and semiconductor cleaning equipment business. Features PHT will actively operate globally as a niche top company in the semiconductor industry, specializing in wafer automatic peeling equipment (peeling cleaning machines). PHT has proposed transport and cleaning solutions for compound semiconductors, including next-generation SiC (silicon carbide) and GaN (gallium nitride) materials, utilizing silicon wafer transport and laser processing technology. We are particularly proactive in approaching the power semiconductor market. Our company is creating a comprehensive solution provision system for semiconductor manufacturing equipment aimed at energy conservation (electric vehicles, power control).
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