Measurement of Glass Transition of Polyethylene (PE) in Dynamic Mechanical Analysis (DMA)
The glass transition of polyethylene (PE), which cannot be captured by DSC, can be measured using DMA. Please make use of this to obtain the characteristics of PE.
●Objective: Measurement of the glass transition of polyethylene (PE) ●Method: Dynamic Mechanical Analysis (DMA) ●Results: Measurement of the glass transition of PE, which cannot be captured by DSC In this case, we will introduce "Measurement of the glass transition of polyethylene (PE) using dynamic mechanical analysis (DMA)." Please take a moment to read the PDF materials. Our company also specializes in various thermal analyses including DSC, TG/DTA, and TMA. ●DSC: Can be used for analysis of sample melting, glass transition, thermal history, crystallization, curing, Curie point, etc., as well as for measuring specific heat. ●TG/DTA: Can be used for analysis of sample moisture content, ash content, decomposition, oxidation, and thermal resistance evaluation. ●TMA: Can be used for measuring sample expansion rate, glass transition, and softening point. We would be happy to assist you with any inquiries regarding thermal analysis. https://www.seiko-sfc.co.jp/service/thermal.html Case Studies https://www.seiko-sfc.co.jp/case/index.html *Other materials are also available. Please request them via the inquiry button, and we will send them to you.
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.