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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. CMP device [Desktop type for research and development, compatible with wafers up to 300mm!]

CMP device [Desktop type for research and development, compatible with wafers up to 300mm!]

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last updated:Sep 13, 2022

北川グレステック 本社
北川グレステック 本社
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We offer a lineup of CMP equipment ranging from tabletop models to those compatible with 300mm wafers! Customization and new designs are possible, including features like Dry-in/Dry-out!

We offer a lineup ranging from compact models suitable for research and development to models compatible with 300mm wafers. We can also propose specification changes, custom orders, and CMP automatic devices that allow for Dry-in / Dry-out according to your needs. We have demo units available, so we can conduct demo tests in your presence. 【We can also accommodate requests such as the following】 ■ Chemical compatibility (capable of handling various acidic and alkaline slurries) ■ Support for abrasive supply systems ■ Desire to include sensors to measure vibrations ■ Wanting to apply higher loads than usual ■ Wanting to measure temperature and humidity inside the device *For more details, please refer to the PDF document or feel free to contact us.

    Wafer processing/polishing equipment
イプロス用 卓上型CMP装置-好適.jpg

CMP device [Desktop type for research and development, compatible with wafers up to 300mm!]

イプロス用 卓上型CMP装置-好適.jpg
イプロス用 卓上型CMP装置-好適.jpg
  • Related Link - https://www.kemet.jp/cmp_mat.html

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basic information

【Lineup】 ■BC-15CN ■MAT-ARW-461M ■MAT-ARW-681MS II ■MAT-ARW-8C1MS 【Cleaning Equipment】 ■MAT-ZAB-8S1M *For more details, please refer to the PDF document or feel free to contact us.

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北川グレステック

北川グレステック 本社

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Kitagawa Gresstech Co., Ltd. was established through the merger of System Seiko Co., Ltd. and Kemet Japan Co., Ltd. By combining the technology cultivated by System Seiko in HDD polishing equipment with the know-how developed by Kemet Japan in polishing consumables and contract processing for semiconductors and electronic components, we aim to strengthen our sales and development capabilities and further expand our business.

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