Classifying diamonds in-house! Introducing the characteristics of "water-based (W2)" and "oil-based (O3)" as well as the polishing targets!
"Kemet Diamond Slurry" offers a wide range of particle sizes, concentrations, and solutions to meet the needs of the lapping and polishing process. We provide two types of slurries: "Water-based (W2)," which has excellent cleaning properties and achieves a fast processing rate, and "Oil-based (O3)," which excels in lubrication and achieves a high surface roughness. Additionally, we can also provide slurries with other particle sizes. 【Features】 <Water-based (W2)> ■ Characteristics: Excellent cleaning properties and fast processing rate ■ Polishing targets: Sapphire, SiC, SUS304, SUS316, carbon, cemented carbide, ceramics, etc. <Oil-based (O3)> ■ Characteristics: Excellent lubrication and high surface roughness ■ Polishing targets: General iron-based materials, workpieces prone to rust *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Kitagawa Gresstech Co., Ltd. was established through the merger of System Seiko Co., Ltd. and Kemet Japan Co., Ltd. By combining the technology cultivated by System Seiko in HDD polishing equipment with the know-how developed by Kemet Japan in polishing consumables and contract processing for semiconductors and electronic components, we aim to strengthen our sales and development capabilities and further expand our business.