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  6. CMP slurry

CMP slurry

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last updated:Aug 29, 2022

北川グレステック 本社
北川グレステック 本社
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Widely customizable CMP slurry

CMP (Chemical Mechanical Polishing) slurry is used in the semiconductor manufacturing process to polish the surface of substrates. Chemical etching softens the material, and mechanical abrasion removes the material, resulting in the flattening of the original three-dimensional shape. This is the mechanism of CMP. Our CMP slurry has a proven track record for various applications, including copper wiring for semiconductor circuit miniaturization and speed enhancement, low-temperature sputtering for cost-effective aluminum wiring, and compounds that excel in high-speed signal processing. It is composed of a chemical reaction solution and nano-sized polishing particles, characterized by minimal generation of coarse particles and sedimentation, ensuring stable quality. *Please feel free to contact us.*

    Wafer processing/polishing equipment
CMPスラリー.jpg

CMP slurry

CMPスラリー.jpg
CMPスラリー.jpg
  • Related Link - https://www.kemet.jp/cmp_slurry.html

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basic information

【Features】 ■ Stable quality with minimal generation of large particles and sedimentation of particles ■ Technical support provided by knowledgeable and experienced application engineers ■ Guidance tailored to specific applications *For more details, please refer to the PDF document or feel free to contact us.

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CMP slurry

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北川グレステック

北川グレステック 本社

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Kitagawa Gresstech Co., Ltd. was established through the merger of System Seiko Co., Ltd. and Kemet Japan Co., Ltd. By combining the technology cultivated by System Seiko in HDD polishing equipment with the know-how developed by Kemet Japan in polishing consumables and contract processing for semiconductors and electronic components, we aim to strengthen our sales and development capabilities and further expand our business.

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