CMP slurry
Features ◆ Uniform particle size (sharp particle size distribution, spherical particles). ◆ High efficiency (unique formulation, stable pH). ◆ High flatness (surface quality: Ra < 0.2 nm, TTV < 3 μm). ◆ High number of circulation uses. ◆ Capable of low-temperature polishing (below 35°C). ◆ We offer a specially formulated slurry for processing SIC wafers. ◆ Neutral and weakly acidic slurries are available for aluminum nitride processing.
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basic information
CMP slurry is a silica slurry optimized specifically for polishing sapphire, SiC wafers, aluminum nitride, ceramics, and metal materials. It has excellent particle size uniformity, high dispersion stability, and provides a uniform and good finish surface.
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Applications/Examples of results
◆Sapphire LED materials ◆Stainless ◆Optical crystals / SiC surface polish ◆AlN substrate ◆SiC wafer ◆Optical fiber / optical connector
Detailed information
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Company information
Summit Super Abrasives Co., Ltd. is committed to providing cutting-edge products by always focusing on abrasives, with the motto of selected (Summit) best (Super) abrasives (Abrasive).
