We can provide CMP slurries that meet customer needs for the flattening of semiconductor substrates with mixed materials.
Our company develops and manufactures CMP slurries. CMP stands for Chemical Mechanical Polishing, which involves mechanical removal and polishing while chemically dissolving materials. The chemical actions applied depend on the chemical properties of the material to be removed. The CMP slurry for semiconductor copper wiring is mass-produced for advanced devices and has gained high trust as it has been certified as a partner by major electronics manufacturers. We are also advancing the development of CMP slurries for cutting-edge devices. [Our company offers contract manufacturing of various slurries and coatings] If you have any issues with manufacturing, please feel free to contact us.
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basic information
【Application】 ■Processing of brittle materials Achieves contamination reduction suitable for strict precision processing processes. Through raw material management, dispersion processes in clean rooms, and innovative maintenance of equipment, it prevents the intrusion of heavy metals, which are most disliked by semiconductors, as well as microorganisms like bacteria and impurities to a level that cannot be detected. 【Product Lineup】 ■Cu CMP Slurry ●Compatible with 1Step (1Platen) polishing ●Can achieve both high-speed polishing and low step height ●High selectivity (Cu/Ta = over 1000) ●Suppression of Cu residue ●Prevention of incubation ●Uses hydrogen peroxide as an oxidizing agent ●Can be concentrated ■Resin polishing slurry Polishing characteristics (single film) Polyimide film polishing speed 1-2μm/min @ 4psi ●Polishing speed varies depending on the degree of heat treatment of the polyimide film ●Uses excellent polishing promoters, avoiding strong alkalis and environmentally harmful substances ■HDD head polishing slurry ●Achieves high cut rate and low smear ●Meets impurity standards restricted in the HDD industry (silicone, amide, etc.)
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Applications/Examples of results
■Processing of brittle materials - For semiconductor copper wiring formation (CMP slurry) - For simultaneous polishing of dissimilar materials (CMP slurry)
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Company information
TOPPAN Infomedia is a company that has grown significantly through the fusion of the manufacturing expertise of Toppan Label Co., Ltd., which has been engaged in label production for many years, and TMP Co., Ltd., a leader in the magnetic media industry that also manufactured IC cards. By combining manufacturing technologies of completely different products, we have created new value. Moving forward, we will continue to create "what doesn't exist yet, starting from here" based on the various technological capabilities we possess.
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