CMP slurry
CMP slurry is a silica slurry optimized specifically for polishing processes of materials such as sapphire, SiC wafers, aluminum nitride, ceramics, and metals. It has excellent particle size uniformity, high dispersion stability, and produces a uniform and good finishing surface.
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basic information
GRISH's Silica Slurry (CMP) is a low metal ion type polishing liquid made from high-purity silicon powder, utilizing our unique processing technology, and is widely used for nano-level surface finishing. Product Number Particle Size Shape SO-100-PF 90nm-120nm SO-80-PF 70nm-90nm SO-60-PF 50nm-70nm Spherical SO-40-PF 30nm-50nm SO-20-PF 10nm-30nm Specifications can be customized according to customer requests.
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Applications/Examples of results
1. The GSP series is used for coarse and fine polishing of semiconductor substrate materials such as silicon wafers, sapphire, and silicon carbide. 2. The SOQ series is used in combination with cerium films and flocked films specifically for fiber optic connectors. 3. The GHP series is suitable for polishing hard disks. 4. The MP series is used for global planar polishing during the manufacturing of IC electronic circuits.
Company information
We provide precision polishing films for surface processing, industrial synthetic diamond powder, diamond powder and diamond slurry for sapphire polishing, cleaning tapes for LCD panels, and more. We aim to maximize customer satisfaction with high quality and low prices. We also respond to inquiries regarding polishing processes. Japan Office: Summit Super Abrasive Co., Ltd. 1-14-17-6F Johoku-cho, Takatsuki City, Osaka 569-0071 Tel: 0081-72-673-2780 Fax: 0081-72-673-2781
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