This is a high-speed inspection taping machine for high-frequency semiconductors and SMDs. It can support simultaneous measurement, appearance inspection, marking, and more, depending on the options.
<Overview> This machine is a high-speed inspection taping machine that performs various inspections on devices supplied by a parts feeder, classifies them, and stores them in tape and reel. <Features> 1. Device Inspection It can accommodate various inspections such as characteristic tests and appearance inspections using probes and conductive rubber suitable for high-frequency measurements. It also supports simultaneous measurements. 2. Classification Function (Optional) It is possible to classify workpieces based on the results of various inspections, including optical and appearance inspections. 3. Automatic Repair Function (Optional) The machine conducts posture and appearance inspections of workpieces stored in tape, automatically ejecting defective workpieces and reinserting good ones, eliminating the need for operator repair work and enhancing productivity. 4. Five-Sided Inspection (Optional) By adopting a detachable inspection unit, it can simultaneously conduct appearance inspections on five sides of the workpiece, including the side and bottom, at one station.
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basic information
Work Type: SMD Device Work Supply Method: Parts Feeder Tape Width: 8 or 12mm (Other sizes can be discussed separately) Sealing Method: Thermo Compression Capacity: 500 pieces/min (varies depending on conditions) Equipment Dimensions: 1350×900×2350 mm Equipment Weight: 800 kg
Price range
P7
Delivery Time
Applications/Examples of results
High-frequency semiconductor QFN Electronic components Capacitor MLCC Resistor LED Filter SAW, LTCC, BAW etc.
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Our company is headquartered in Kanazawa City, Ishikawa Prefecture, and has sales offices and factories both within and outside the prefecture. We focus on the bottling business, which involves filling beverages and other products, and we are expanding into various fields such as solid-liquid mixing and dispersion systems, laser processing machines (including fiber lasers and CO2 lasers), and semiconductor assembly equipment (such as taping machines, multifunctional test handlers, ball mount machines, and bonders). Please feel free to contact us if you have any inquiries.