Reduce prototype development costs and effort!
☑ Eliminate variations in manual soldering ☑ Enables soldering with low thermal stress ● With the introduction of new equipment, soldering can be done simply without the need for expensive masks! ● It is also possible to melt solder balls with a laser and blow them onto terminals using N2! ● Localized processing becomes possible, so flux is unnecessary, and thermal load on the entire circuit board is not required!
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basic information
■Jet Mode This mode involves irradiating the solder ball at the tip of the capillary with a laser to melt it and then ejecting it onto the substrate pad. It allows for soldering at lower temperatures and at high speeds. ■Standard Mode This mode involves irradiating the solder ball at the tip of the capillary with a laser to melt it, then lowering the capillary to perform the soldering. It enables soldering with higher precision.
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Applications/Examples of results
■ Fine wiring soldering Reduction of worker variability through soldering iron work ■ Soldering of module products Soldering to narrow pitch terminals is also possible ■ Ball mounting Initial cost reduction, also supports small-scale prototypes ■ Soldering to resins not compatible with reflow Can be handled with low-temperature stress
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Company information
Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.
