Wafer surface modification and precision bonding equipment

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last updated：Oct 06, 2022

ケニックス

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Ultra-high vacuum - compatible with pressurized atmospheres! A bonding system equipped with uniform heating and pressurization functions!

This product is a device for precision bonding of wafer-level silicon, metal, quartz, glass, etc., after surface modification treatment in a vacuum or any atmosphere. It supports various bonding for 4 to 6-inch wafer levels. We propose surface modification treatments and precision bonding models suitable for bonding materials such as anodic bonding, diffusion/eutectic bonding, direct bonding, and thermocompression bonding. 【Features】 ■ Supports various bonding for 4 to 6-inch wafer levels ■ Pre-treatment function with surface modification treatment suitable for any material ■ Bonding system equipped with uniform heating and pressurization functions ■ Heating and cooling system to reduce residual stress ■ Capable of operating in ultra-high vacuum to pressurized atmosphere ■ Control mechanism for arbitrary position pressurization and voltage application *For more details, please refer to the PDF document or feel free to contact us.

Related Link - http://www.kenix.jp/product/ueha.html

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【Features】 ■Uniform Heating and Pressurization System - Adopts a system that pursues uniformity in heating and pressurization conditions that can accommodate any atmosphere. ■Special Holder - Enables reliable bonding while maintaining alignment accuracy. - Allows for good bonding through an automatic clip release function during the bonding process. ■Pressurization and Voltage Application Control System - Standardizes control of multiple pressurization and voltage application positions, with a stepwise application control system. - Reduces residual stress, enabling bonding with fewer voids. ■Various Surface Modification Functions - Surface modification treatment technology that affects precision bonding can be optionally installed as a pretreatment function. - Can accommodate requests for hydrophilization treatment, surface activation treatment, cleaning, etc. *For more details, please refer to the PDF document or feel free to contact us.