Direct bonding using an atmospheric pressure plasma device.
Precise Series (Downstream Type, Planner Type)
Molecular Bonding Adhesion Using Atmospheric Pressure Plasma Devices: Basic Concept of Downstream Atmospheric Pressure Plasma Joining and Adhesion
This is an adhesive technology that eliminates transmission loss suitable for FCCL manufacturing related to millimeter waves, using an atmospheric pressure plasma device. It is a reliable adhesive-free bonding method that utilizes molecular bonding, maintaining a flat state of the work surface while achieving bonding with dissimilar materials such as fluororesins and other films. By changing the type of gas used, it is possible to selectively choose covalent bonding molecules, optimizing the bonding with the counterpart. It can also be applied to improve existing adhesive strength. This document introduces an overview of bonding and adhesion using a "downstream atmospheric pressure plasma device," necessary pretreatments, and the benefits of utilization. [Contents] ■ Basic concepts ■ Advantages ■ Image of plasma treatment *Available for viewing via PDF download. Please feel free to contact us for inquiries.
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basic information
**Features of Downstream Atmospheric Pressure Plasma Equipment** - Capable of processing with minimal damage to the substrate and changes in surface roughness - Adhesion of copper foil to LCP and fluororesin films - Internal processing of sponge and non-woven fabrics is also possible Our company offers downstream atmospheric pressure plasma equipment that features high performance due to the reduction of the distance between the plasma generation area and the workpiece, as well as no changes in the intermolecular crosslinking characteristics within the workpiece during plasma generation using UV and Deep UV. For more details, please feel free to contact us.
Price information
The price of the equipment varies depending on the work processing width. Please specify the work processing width when requesting a quote. We manufacture various tabletop experimental machines and also conduct on-site experiments at our lab.
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Applications/Examples of results
You can view it by downloading the PDF. Please feel free to contact us.
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Company information
We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.
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