[Problems with Aluminum-Backed Boards] I want to adopt them, but the commercially available ones do not match the specifications.
Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.
When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using our unique method of bonding the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting with reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.
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【Features (Solder Bonded Aluminum Base Substrate)】 ■ There are two bonding methods available, which can be selected based on budget and application. ■ A method that uses a bonding sheet to adhere aluminum to the substrate. ■ A method that melts the solder plating applied to the aluminum using heat press, allowing it to alloy with the copper foil portion of the substrate for adhesion. ■ The aluminum part is grounded and has the same performance as aluminum base through-hole substrates. ■ It is possible to reduce the diameter of through-holes. ■ The design flexibility is improved. * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Since our establishment, Kyoei Electric Co., Ltd. has consistently provided products that satisfy our customers based on the philosophy of "coexistence and co-prosperity with society," contributing to societal development for half a century through our business activities. Our "trading business," which handles a wide range of electronic, electrical, and industrial materials and components, as well as manufacturing equipment and office automation devices, and our "manufacturing business," which conducts integrated production from the design and development to mass production of printed circuit boards, are the two wheels that drive our company. We are fully committed to leveraging the characteristics of these two businesses to coordinate products and technology, providing various values globally in response to the demands of the times. Additionally, aiming to enhance customer satisfaction, we have obtained ISO 9001 certification for our quality management system, and further, in line with our policy of being an "environmentally friendly company," we have obtained ISO 14001 certification for our environmental management system. Moving forward, we will continue to strive to meet our customers' needs at a high level with the "co-prosperityism" that we have cultivated since our founding.
![[Concerns about Device Assembly] The circuit board is thin and difficult to handle.](https://image.mono.ipros.com/public/product/image/cc2/2001018028/IPROS11294910426766784877.jpeg?w=280&h=280)