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  6. Analysis of defective connector terminal contacts with Au plating【STEM/EDS】

Analysis of defective connector terminal contacts with Au plating【STEM/EDS】

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last updated:Aug 02, 2023

セイコーフューチャークリエーション
セイコーフューチャークリエーション
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It can be confirmed without loss by the "sampling method that protects the surface" of the adhered layer (approximately 20nm) on the surface of the connector terminal plated with STEM.

In STEM (Scanning Transmission Electron Microscopy) and EDS (Energy Dispersive X-ray Spectroscopy), information about the composition of the sample (contrast images reflecting atomic numbers) can be obtained by scanning a finely focused electron beam over the sample. The following features are also available: - Observation of changes in diffraction contrast by varying the angle of incidence of the electron beam - Determination of whether the observation target is crystalline - Acquisition of information about crystal defects (dislocations, twins, etc.) within the crystal In this case, we will introduce "Failure Analysis of Au-Plated Connector Terminal Contacts Using STEM." Please take a moment to read the PDF materials. Additionally, our company conducts various cross-sectional analyses using not only STEM but also TEM and SEM. We would be happy to assist you, so please feel free to reach out. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/ *Other materials are also available. If you request them through the inquiry button, we will send them to you.

    Plating EquipmentOther metal materialsContract Analysis
case_1911-STEMによるコネクタ端子接点不良解析.png

Analysis of defective connector terminal contacts with Au plating【STEM/EDS】

case_1911-STEMによるコネクタ端子接点不良解析.png
case_1911-STEMによるコネクタ端子接点不良解析.png
  • Related Link - https://www.seiko-sfc.co.jp/analysis-service/case.…

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● The sampling method that protects the surface allows for the confirmation of the adhesion layer on the terminal surface (approximately 20nm) without loss. ● According to the EDS analysis results, the main components of the adhesion are C (carbon) and O (oxygen), indicating that the contact failure is due to organic contamination. ● For more details, please contact us or download the catalog.

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Analysis of defective connector terminal contacts with gold plating in STEM/EDS.

Analysis of defective connector terminal contacts with gold plating in STEM/EDS.

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Seiko Future Creation Online Attendance Analysis

Seiko Future Creation Online Attendance Analysis

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セイコーフューチャークリエーション

セイコーフューチャークリエーション

Testing, Analysis and Measurement

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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.

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