"What issues arise from differences in implementation conditions or aging deterioration?" We will examine the problems lurking within the solder.
The Electron Backscatter Diffraction Pattern (EBSD) method, when combined with a scanning electron microscope (SEM), enables the following: - Analysis of crystal grain size and phase structure in micro-regions - Evaluation of residual stress in small areas such as mounting parts (with analysis examples at approximately 50μm) This case introduces the measurement of internal strain in solder cross-sections using EBSD. Changes in "internal strain of solder due to thermal shock testing" were confirmed with EBSD. This measurement technique can be applied to predict potential defects arising from variations in solder conditions or aging degradation. We encourage you to give it a try. Additionally, our company conducts various cross-sectional analyses using TEM in conjunction with EBSD and SEM. We would be happy to assist you, so please feel free to reach out. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/ *We have many other materials available. If you request through the inquiry button, we will send them to you.
Inquire About This Product
basic information
The purpose/method/results of this case study are as follows: ● Purpose: Investigate the internal strain of solder in IC packaging after thermal shock testing ● Method: SEM EBSD method (crystal orientation analysis after cross-section formation) ● Results: Recognition of the distribution of strain within the solder We would appreciate it if you could download the catalog for more details. Please feel free to contact us for other case studies as well.
Price range
Delivery Time
Applications/Examples of results
Please feel free to contact us regarding examples of our achievements. We will be happy to provide an introduction.
catalog（2）
Download All Catalogs
Company information
Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.