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  6. Plating processing for thin sheet precision press products.

Plating processing for thin sheet precision press products.

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last updated:Aug 20, 2024

茨城プレイティング工業
茨城プレイティング工業
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Plating process for thin plate t=0.15mm with a stamping finish.

It is possible to apply a "high yield" plating to thin plate press-processed products that are prone to "overlapping" between products. *1 Normally, overlapping can cause defects such as lack of plating, stains, and unevenness. *2 Yield is the ratio of the number of good products to the input quantity (the quantity processed at one time). Performance of the parts in the photo: Yield approximately 99.80%.

    Sensors
薄板精密プレス品.jpg

Plating processing for thin sheet precision press products.

薄板精密プレス品.jpg
薄板精密プレス品.jpg
  • Related Link - https://i-plating.co.jp

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basic information

Shape: Stamped Metal CAP Size: 2.0mm × 1.5mm × H 0.4mm t0.15mm Material: Kovar Base Plating: Electrolytic Nickel Final Plating: Hard Gold (Au-Co Alloy) Below are our processing achievements. Available Materials: Kovar, C5210 Types of Plating: Electrolytic Nickel, Electroless Nickel (Ni-P), Hard Gold (Au-Co)

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Main applications: Metal CAP for MEMS, automotive components (high-precision sensors, Lidar, etc.)

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茨城プレイティング工業

茨城プレイティング工業

Manufacturing and processing contract

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Our business at Ibaraki Plating Industry involves applying plating to metal parts entrusted to us by our customers, in accordance with their requests. Our plated products are utilized in various fields, including sensor components in automobiles, electronic devices such as smartphones, digital cameras, and wearable devices, as well as medical equipment. In recent years, we have focused on "gold plating" of components for semiconductor inspection jigs, as well as micro contacts (plungers) and fine precision springs, which we consider our "strength." We aim to be a company that is trusted and can contribute to our customers, employees, and the local community, and we strive to be a group of engineers specializing in the plating processing field. In particular, we will pursue plating technology for precise and fine electronic components. We kindly ask for your warm support and assistance.

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