Analyze the eddy currents flowing between two conductors! Using the frequency response magnetic field analysis software "PHOTO-EDDYTMjω".
We will introduce the analysis results of eddy current distribution, self-inductance, and mutual inductance. The analysis was conducted for three cases: only conductor 1, only conductor 2, and both conductors 1 and 2 carrying current. The mesh scale consists of 3,200 elements and 4,800 nodes. Using the magnetic field analysis module "PHOTO-EDDYTMjω," it is possible to perform the analysis with a mesh of only the conductors, eliminating the need for air mesh. [Case Overview] ■ Software Used: PHOTO-EDDYTMjω ■ Analysis Conditions - Current Value: 1[A] - Material Properties: Relative Permeability 1.0, Electrical Conductivity 1.0×10^6[S/m] - Frequency: 1.0[kHz] *For more details, please refer to the related links or feel free to contact us.
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At Photon, we are developing "electromagnetic field analysis software" that models and simulates products and components utilizing electromagnetic phenomena on a computer. In traditional design and development environments, the process has primarily revolved around trial and error through prototyping based on the experience of engineers and experiments with prototypes. However, conducting experiments using actual prototypes and analyzing the results requires significant time and cost. Moving forward, transitioning from an experimental and prototyping-based approach to an analysis-based design approach will be a crucial challenge for improving productivity, and establishing simulation technology as the core of analysis-based design techniques will be essential. In this context, Photon is developing and providing "analysis software" focusing on electromagnetic fields, as well as heat, vibration, and sound fields. By utilizing Photon's software, efficient development and design of various industrial products can be achieved. In this way, Photon aims to support users in reducing the number of prototypes, lowering development costs, and shortening development periods in their manufacturing environments, ultimately enhancing their competitiveness.
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