The capacitance of the cathode is theoretically determined by approximating a cylindrical capacitor as a parallel plate capacitor, and compared with the analytical results!
The wound-type capacitor has a structure that alternately layers electrode foil and dielectric, featuring a compact design while increasing the surface area of the electrodes. In "PHOTO-VOLTBM," there is no need for air mesh, allowing for the easy creation of complex-shaped models in conjunction with programmatic mesh deformation. In this case study, we will conduct an electric field analysis of the wound-type capacitor. Additionally, we will compare the capacitance obtained from the analysis with the theoretical value. For detailed information on the analysis conditions and results, please refer to the related links below. [Case Overview] ■ Analysis Module: PHOTO-VOLTBM *For more details, please refer to the related links or feel free to contact us.
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At Photon, we are developing "electromagnetic field analysis software" that models and simulates products and components utilizing electromagnetic phenomena on a computer. In traditional design and development environments, the process has primarily revolved around trial and error through prototyping based on the experience of engineers and experiments with prototypes. However, conducting experiments using actual prototypes and analyzing the results requires significant time and cost. Moving forward, transitioning from an experimental and prototyping-based approach to an analysis-based design approach will be a crucial challenge for improving productivity, and establishing simulation technology as the core of analysis-based design techniques will be essential. In this context, Photon is developing and providing "analysis software" focusing on electromagnetic fields, as well as heat, vibration, and sound fields. By utilizing Photon's software, efficient development and design of various industrial products can be achieved. In this way, Photon aims to support users in reducing the number of prototypes, lowering development costs, and shortening development periods in their manufacturing environments, ultimately enhancing their competitiveness.
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