Development, prototyping, and evaluation services utilizing know-how in bear chip implementation and micro joining technology.
We utilize our implementation technology to conduct prototype and evaluation of functional and performance samples in product development, as well as evaluation samples for construction methods and materials in implementation development, bare chip mounting on special substrates, and micro joining between substrates. In addition to the combinations of materials provided by customers during prototyping, we also propose the best construction methods and material combinations for the requested products. We are capable of mounting on special substrates and accept orders starting from just one prototype.
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basic information
【Main Content】 ○ Development design and prototyping of small-sized implementation modules ○ Bump processing (Au stud bumps, solder) ○ Bare chip mounting (SBB, GGI, ECS, GBS, etc.) ○ Interconnection between substrates (FOB, FOF, BOB) If you are facing any of the following issues, please feel free to contact us! □ Want to miniaturize products but lack experts □ Insufficient man-hours for implementation method development □ Want to outsource the development design of deployment models □ No research and development department for mounting technology For more details, please download the catalog or contact us.
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Company information
Our company pursues bare chip direct mounting and micro joining technology for substrate interconnection, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness through efforts to miniaturize, slim down, enhance functionality, and strengthen cost competitiveness of all products. In particular, we carry out the miniaturization and modularization of circuit mounting substrates through bare chip direct mounting, from concept development and design to prototyping, evaluation, analysis, and mass production. We also provide a one-stop service through our in-house factory to offer reasonable solutions. We will realize bare chip direct mounting, which has been difficult to implement due to cost constraints for small-scale production, through our module technology and manufacturing capabilities. Additionally, the cleanroom class within our factory ranges from 100 to 1000. Please feel free to consult us when considering the miniaturization, slimness, and modularization of circuit mounting substrates for electronic devices.