Development, prototyping, and evaluation services utilizing know-how in bear chip implementation and micro joining technology.
We utilize our implementation technology to conduct prototype and evaluation of functional and performance samples in product development, as well as evaluation samples for construction methods and materials in implementation development, bare chip mounting on special substrates, and micro joining between substrates. In addition to the combinations of materials provided by customers during prototyping, we also propose the best construction methods and material combinations for the requested products. We are capable of mounting on special substrates and accept orders starting from just one prototype.
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basic information
【Main Content】 ○ Development design and prototyping of small-sized implementation modules ○ Bump processing (Au stud bumps, solder) ○ Bare chip mounting (SBB, GGI, ECS, GBS, etc.) ○ Interconnection between substrates (FOB, FOF, BOB) If you are facing any of the following issues, please feel free to contact us! □ Want to miniaturize products but lack experts □ Insufficient man-hours for implementation method development □ Want to outsource the development design of deployment models □ No research and development department for mounting technology For more details, please download the catalog or contact us.
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Company information
We provide one-stop support for the miniaturization and thinning of electronic devices through bare chip direct mounting technology. Micro Module Technology Co., Ltd. specializes in micro-joining technologies for bare chip direct mounting and interconnection between substrates. We pursue manufacturing solutions that enable miniaturization, higher functionality, and improved cost competitiveness of electronic devices. For the downsizing and modularization of printed circuit boards, we offer integrated support covering concept planning, design and development, prototyping, evaluation and analysis, and mass production. By operating our own in-house manufacturing facilities, we realize a one-stop service and provide bare chip direct mounting technologies at more reasonable costs, which were previously difficult to adopt for small-lot production due to cost constraints. Our factory is equipped with cleanroom environments of Class 100 to 1000, enabling the production of high-quality modules and printed circuit boards. If you are considering miniaturization, thinning, or modularization of electronic circuit boards, please feel free to contact us.
