Micro Module Technology Co., Ltd.
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Micro Module Technology Co., Ltd. Company Profile
Declaration of a module revolution with the latest implementation technology!
We provide one-stop support for the miniaturization and thinning of electronic devices through bare chip direct mounting technology. Micro Module Technology Co., Ltd. specializes in micro-joining technologies for bare chip direct mounting and interconnection between substrates. We pursue manufacturing solutions that enable miniaturization, higher functionality, and improved cost competitiveness of electronic devices. For the downsizing and modularization of printed circuit boards, we offer integrated support covering concept planning, design and development, prototyping, evaluation and analysis, and mass production. By operating our own in-house manufacturing facilities, we realize a one-stop service and provide bare chip direct mounting technologies at more reasonable costs, which were previously difficult to adopt for small-lot production due to cost constraints. Our factory is equipped with cleanroom environments of Class 100 to 1000, enabling the production of high-quality modules and printed circuit boards. If you are considering miniaturization, thinning, or modularization of electronic circuit boards, please feel free to contact us.
Business Activities
◆ Development of miniaturized and high-performance printed circuit boards using bare chip mounting technology, as well as various module developments ◆ Contract development of bare chip mounting processes (Integrated support from mounting study and prototyping to evaluation and analysis) ◆ Support for various flip-chip mounting processes (SBB, ESC, GGI, ACF & P, NCF & P, GBS) ◆ Prototyping, evaluation, and analysis of wire bonding and stud bump processing ◆ Development, manufacturing, and sales of camera modules and sensor packages ◆ Development and prototyping support for next-generation power modules
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Development and manufacturing of semiconductor and sensor packaging & camera modules.
One-stop support for the development and prototyping of semiconductor and sensor packaging, as well as semiconductor modules, utilizing semiconductor bare chip mounting technology for small to medium-scale production.
We provide one-stop support from the development of semiconductor bare chip mounting and small-sized mounting modules using micro-joining technology to small and medium-scale mass production. We also accept contract manufacturing for cameras. If you are facing any of the following issues, please feel free to contact us! 【Module Development and Mounting Technology Development Services】 ■ We want to miniaturize the mounting substrate but lack specialists. ■ We want to develop new mounting methods. 【Prototyping Services】 ■ We want to create principle prototypes and engineering samples. ■ We want to conduct mounting prototypes for evaluating components and materials. 【Small to Medium Scale Mass Production Services】 ■ We do not have a factory for mass production of several dozen to tens of thousands of units per month. ■ We want to carry out mass production at a domestic facility. We want to mass-produce special mounting modules. We also offer ultra-compact CMOS camera modules. Shape and angle changes are possible, and they are equipped with auto white balance noise reduction and automatic exposure control functions.
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Detailed information
| Company name | Micro Module Technology Co., Ltd. |
|---|---|
| number of employees | 12 |
| Contact address | postalcode 230-0045 Kanagawa/ Tsurumi-ku, Yokohama-shi/ 1-1-40 Suehirocho, Inside Yokohama City Industry-Academia Collaborative Research CenterView on map TEL：045-510-3080 FAX：045-510-3081 |
| Business Locations | Click here for the list |
| Industry | Manufacturing and processing contract |
Micro Module Technology Co., Ltd. Building Image