Ultra-compact USB camera module compatible with YUV (uncompressed) output and MJPEG output!
The "IKURA-M12 series" and "IKURA-M5" are USB camera modules that use a 2M_Pixel CMOS sensor and comply with the UVC format. (Not all UVC commands are supported.) They support YUV (uncompressed) output and MJPEG output, allowing for selection based on application needs. The "IKURA-M12 series" measures 15mm x 15mm, and the lens can be chosen from our standard products. The "IKURA-M5" is an ultra-compact board-type camera measuring 13mm x 13mm. Both can be connected to an LED board, enabling shooting in dark environments. 【Main Applications】 - Office automation equipment - Measuring instruments - Machine tools - AV equipment - Home appliances - Communication devices (excluding trunk lines)
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【Main Features】 ■ Auto White Balance ■ Automatic Exposure Control ■ Edge Enhancement ■ Noise Reduction ■ Shading Correction ■ Pixel Defect Correction ■ Image Quality Correction Function For more details, please download the catalog or contact us.
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Our company pursues bare chip direct mounting and micro joining technology for substrate interconnection, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness through efforts to miniaturize, slim down, enhance functionality, and strengthen cost competitiveness of all products. In particular, we carry out the miniaturization and modularization of circuit mounting substrates through bare chip direct mounting, from concept development and design to prototyping, evaluation, analysis, and mass production. We also provide a one-stop service through our in-house factory to offer reasonable solutions. We will realize bare chip direct mounting, which has been difficult to implement due to cost constraints for small-scale production, through our module technology and manufacturing capabilities. Additionally, the cleanroom class within our factory ranges from 100 to 1000. Please feel free to consult us when considering the miniaturization, slimness, and modularization of circuit mounting substrates for electronic devices.