Support for miniaturization and modularization of circuit implementation boards using bare chip implementation, from concept to prototype to mass production!
We pursue micro-joining technology for bare chip mounting and inter-board connections, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness. From concept to development design, prototyping, evaluation, analysis, and small to medium-scale mass production, we provide a one-stop service at our in-house factory (clean room class: 100 to 1000). We will realize bare chip mounting, which has been difficult to implement cost-effectively for small-scale production, through our module technology and manufacturing capabilities. **Benefits of Bare Chip Mounting** - **Increased Added Value** → Miniaturization and thinning expand product applications and create new markets. → Incorporating semiconductor backend processes enhances manufacturing added value. - **Improved Cost Competitiveness** → Miniaturization and standardization improve production efficiency and reduce material costs. → Compared to miniaturization through System on Chip (SoC), development costs can be reduced to about one-tenth. - **Enhanced Performance** → The elimination of secondary wiring in semiconductor packages significantly shortens wiring length, improving performance degradation due to wiring loss. - **Environmental Considerations** → Reducing the number of materials used can decrease waste.
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basic information
**Business Content** - Development, prototyping, evaluation, and analysis of circuit boards for miniaturization using bare chip mounting - Various flip chip mounting - Prototyping and evaluation of wire bonding and bump processing (stud bumps) - Development, manufacturing, and sales of camera modules - Development and prototyping of next-generation power modules If you are facing such issues, please feel free to contact us! **<Module Development and Mounting Technology Development Services>** - Want to miniaturize mounting boards but lack expertise - Want to develop new mounting methods **<Prototyping Services>** - Want to create principle prototypes or engineering samples - Want to prototype mounting on special boards or individual chips and substrates - Want to prototype mounting to evaluate components and materials **<Small to Medium Scale Mass Production Services>** - Do not have a factory for mass production of several dozen to tens of thousands of units per month - Want to conduct mass production at a domestic location. Want to mass-produce special mounting modules **<Evaluation and Analysis Services>** - Experiencing issues with semiconductor mounting but do not know the cause - Want to conduct reliability or durability evaluations but do not know how - Want to conduct quality evaluations using various mounting methods For more details, please download the catalog or contact us.
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Applications/Examples of results
◆Camera module (packaging of image sensor, DSP, driver, power chip MCM) ◆IC tag module (flip chip implementation of RFID chip) ◆GPS module (MCM of RF chip, signal processing chip, etc.) ◆LED module (wire bonding of LED microchips, flip chip implementation) ◆LCD module (driver chip implementation, panel-FPC interconnection) ◆Various multi-chip modules (miniaturization of signal processing, control circuit blocks, etc.) For more details, please contact us.
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Company information
Our company pursues bare chip direct mounting and micro joining technology for substrate interconnection, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness through efforts to miniaturize, slim down, enhance functionality, and strengthen cost competitiveness of all products. In particular, we carry out the miniaturization and modularization of circuit mounting substrates through bare chip direct mounting, from concept development and design to prototyping, evaluation, analysis, and mass production. We also provide a one-stop service through our in-house factory to offer reasonable solutions. We will realize bare chip direct mounting, which has been difficult to implement due to cost constraints for small-scale production, through our module technology and manufacturing capabilities. Additionally, the cleanroom class within our factory ranges from 100 to 1000. Please feel free to consult us when considering the miniaturization, slimness, and modularization of circuit mounting substrates for electronic devices.