Micro-ATX application carrier board for COM-HPC Client: conga-HPC/uATX-Client
The 【conga-HPC/uATX-Client】 is an application carrier board for COM-HPC Client modules (Size A, B, C). Designed to be directly integrated into products in a Micro-ATX form factor, it enables early market entry while minimizing NRE costs by combining industrial-grade COM-HPC with customized cooling solutions and comprehensive BSPs for all major RTOS, as well as real-time hypervisors from Real-Time Systems, allowing for rapid response to changing market demands. Additionally, by swapping out the COM-HPC module, applications can be further enhanced for high performance or cost reduction, making it easy to scale and create a full range of product portfolios based on a single type of carrier board. Size: Micro-ATX 244 x 244 mm. Operating temperature range: 0℃ to +60℃.
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basic information
244 x 244 mm
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Delivery Time
Applications/Examples of results
Smart factories, process automation, AI-based quality inspection, industrial vision systems, real-time collaborative robots, autonomous logistics vehicles, self-driving cars, video security, 5G cloudlets, edge devices.
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Company information
Congatec is a manufacturer based in Germany that specializes in products for embedded computing, including standard form factor computer-on-modules such as COM Express, COM-HPC, and Qseven, SMARC according to SGET standards, as well as single-board computers (SBCs). In addition to manufacturing and selling board modules, they also offer services such as custom design and development, as well as product lifecycle management. Congatec's products, which are a trusted leading supplier in the embedded industry, are manufactured according to the latest quality standards and are designed to be robust and long-term supply capable. They are used in a wide range of applications across various fields, including industrial automation in harsh environments, medical imaging, transportation, telecommunications, testing and measurement, as well as smart factories, AI-based quality inspection, vision systems, collaborative robots, autonomous vehicles, and video security.