We offer a "high-concentration low-dielectric constant filler dispersion" that is highly dispersed with spherical silica and spherical boron nitride nanoparticles.
Spherical silica is often used as a filler to protect electronic materials, particularly semiconductors, and by using special spherical silica, we are able to implement "low dielectric constant." Additionally, boron nitride is well-known for its excellent thermal conductivity, but it also possesses excellent insulation and low dielectric constant. Since hexagonal boron nitride is in the form of spherical nanoparticles rather than flakes, it is expected to provide heat dissipation without the need for controlling anisotropy, in addition to having a low dielectric constant. Customization is available according to your needs (such as improving compatibility with target materials or changing solvents).
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basic information
Features - Low dielectric constant fillers are uniformly dispersed, and the long-term stability is also good. Despite having a high concentration of fillers, the low viscosity allows for good handling and high filling into the target object. - The formulation is intended for low dielectric materials such as polyimide (PI), liquid crystal polymer (LCP), epoxy, bismaleimide, cycloolefin polymer (COP), and polyphenylene ether (PPE), using PGMEA along with NMP/DMAc/cyclohexanone (anon)/MEK/toluene as the main solvents. - The spherical silica dispersion not only provides low dielectric properties but also imparts dimensional stability due to its low thermal expansion coefficient (CTE). - The nano boron nitride dispersion consists of nanoparticles (average particle size 300nm) rather than flake-like micro-particles, allowing for low dielectric properties, low thermal expansion, and expected heat dissipation (thermal conductivity) without the need for anisotropic control.
Applications/Examples of results
Usage: Various functional adhesives, sealants, encapsulants, insulating materials, thermal conductive materials, electronic (substrate, component) materials, etc.
Line up（2）
| Model number | overview |
|---|---|
| LDSS-0001 | Pigment and filler type: spherical silica Pigment and filler content (%): 75% Average particle size (nm): 700–850 Solvent: PGM EA |
| LDBN-0001 | Pigment and filler type: (hexagonal) nano boron nitride Pigment and filler content (%): 40 Average particle size (nm): 270–330 Solvent: PGM EA |
catalog（1）
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High concentration low dielectric constant filler dispersion.
Company information
Our company is a manufacturer of intermediate chemicals that produces functional paints, inks, and resins. We, at Tokushiki, are engaged in product development activities with the keyword "delighting the Earth." This is because it is essential to recognize environmental issues and create products that consider the environment. To provide products that meet our customers' needs, we are not only enhancing our accumulated technology but also improving our "product development capabilities and quality control capabilities." As professionals in chemistry, we are creating fine chemical products that demonstrate high functionality in limited resources, in small quantities. Tokushiki will continue to engage in activities that contribute to a better social environment for future generations, while fostering human resource development and teamwork as corporate citizens, and striving to be a company that is trusted by our customers and local communities, and that contributes to society.