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Vacuum deposition method

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last updated:Feb 25, 2023

東邦化研
東邦化研
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We can handle over 50 types of thin film coatings, even from just one piece! Leave thin film formation to us!

A thin film, referred to as "hakumaku" or "usumaku," generally refers to a coating (film) with a thickness at the nano level. Thin films are formed by evaporating or sputtering the material (such as metal) that is to be made into a film within a vacuum apparatus. **"Vacuum Deposition Method"** The vacuum deposition method is a technique where the material (such as metal) intended for the film is heated and evaporated in a vacuum, allowing the vapor (particles) to reach the target object and accumulate to form a film. The vacuum deposition method is characterized by the fact that the vaporized material reaches the target object directly, resulting in minimal damage to the object and the formation of a highly pure film. Toho Kaken Co., Ltd. offers contract processing services for functional thin films with properties such as conductivity, insulation, and corrosion resistance using ion plating, vacuum deposition, P-CVD, and sputtering. We accommodate various functional thin films from prototyping to production. Based on our 35 years of experience, we offer flexible responses to film types, film thickness, deposition conditions, and compatible substrates (materials, sizes, shapes), and we also support masking deposition and pattern formation using metal masks. Please feel free to consult with us.

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Vacuum deposition method

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■Supported Film Types Metal Films: Al, Au, Ag, Cu, Ni, Cr, Mg, B, Ti, Zr, Nb, Mo, Pd, In, Si, Ta, W, Sn, Pt, etc. Stacked Films: Au/Ni/Cr, Au/Pt/Ti, Au/Pd/Ti, Au/Cr, Cu/Cr, etc. Oxide Films: Al2O3, SiO2, TiO2, Cr2O3, ITO, MgO, NbO, Ta2O5, WO3, ZrO2, ZnO, etc. Nitride Films: AlN, BN, CrN, MoN, NbN, SiN, TaN, TiN, etc. Carbide Films: SiC, TiC, BC, etc. ■Maximum Usable Size: 800×1000mm *We have a wide range of equipment from small to large. ■Compatible Substrates - Si Wafer - Glass - Film - Ceramics - Metal Materials - Others

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Vacuum deposition method

Vacuum deposition method

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Ion plating method

Ion plating method

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Sputtering method

Sputtering method

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Plasma CVD method

Plasma CVD method

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東邦化研

東邦化研

Electronic Components and Semiconductors

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Our company offers contract processing (coating services) for functional thin films using ion plating, vacuum deposition, sputtering, and plasma CVD. Since our inception, we have focused on "functional thin films" such as conductivity, insulation, and corrosion resistance. We accommodate various types of films, including metal films, reactive films like oxide, carbide, and nitride films, as well as their laminated films. We have established a system to respond to a wide range of requests, from small-scale prototypes, development, and research to medium-sized production runs. Currently, we have 11 deposition devices in operation, ranging from small machines with a diameter of 300mm to inline mass production machines with a film formation area of 1000mm x 900mm. All processes, from the unboxing of substrates entrusted by customers to the packaging of the coated products, are conducted within a clean room. If you are considering functional thin films, please feel free to contact us! Based on our flexible response and over 35 years of experience, we will meet your needs! *Information about our exhibition participation is also available on our website. Please take a look.

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