Flux application with high efficiency under optimal conditions.
We would like to introduce our tabletop selective spray device, 'ULTIMA-SSP', which we manufacture. Since its launch in 2008, this product has received great acclaim, and the latest model is the "ULTIMA-SSP." It significantly contributes to the streamlining of manual processes when combined with "TakuROBO." 【Features】 ■ Space-saving and energy-efficient ■ Suitable for small lot production of various types and cell production ■ Significant increase in production efficiency when combined with TakuROBO - Production volume: 1300 units/day ⇒ 1500 units/day - Number of operators: 6 ⇒ 2 - Material usage: 18Kg ⇒ 4Kg (Compared to manual processes) ■ Compatible with the program creation system Freedom (optional) *For more details, please refer to the PDF document or feel free to contact us.
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【ULTIMA-SSP Specifications】 ■Dimensions: 640(L) x 630(W) x 365(H)mm ■Weight: Approximately 45Kg ■Supported Boards: Max 250(W) x 330(L)mm, thickness under 2mm ■Air Pressure: 0.4-0.5MPa ■Nozzle: Dual-fluid nozzle ■Tank Capacity: 0.75L ■Operation: Spray gun (X - Y) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
