With the external operation handle, solder quality can be easily controlled! Control the withdrawal angle and flow rate of the "peel-back point"!
The WS-401LF is an automatic soldering machine from the wave soldering series, equipped with the minimum necessary specifications as a "standard model" compatible with lead-free solder. To address the corrosion of the solder pot caused by lead-free solder, the interior of the solder pot is made of custom cast material with ceramic treatment, and the jet nozzle and duct are treated with a corrosion-resistant surface. Additionally, by adjusting the solder release angle and flow rate at the peel-back point, control over the fillet shape has become possible. 【Features】 ■ "Standard model" compatible with lead-free solder ■ Incorporates ceramic treatment in custom cast material ■ Jet nozzle and duct feature corrosion-resistant surface treatment ■ Control over fillet shape is possible *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 - By widening the first wave from 20mm to 40mm, sufficient dip time for slow-wetting lead-free solder is ensured. - By narrowing the gap between the first and second waves (from 150mm to 50mm), the temperature drop between the first and second waves is minimized, eliminating soldering defects (bridging, insufficient solder, etc.). - By increasing the pressure of the solder wave, the solder contactability to the substrate is improved. - Through-hole plating capability is enhanced. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."