Busbar processing [Three selectable cutting methods & small lot prototype support]

Choose from three cutting methods: <Laser processing / Wire processing / Punch processing> Leave small lot bus bar prototypes to us!

Nishino Seiki Manufacturing's "Busbar Processing" accommodates small lot prototypes. Blank processing can be selected from laser processing, wire processing, and punch processing, and supports plate thickness up to t3.0. Since simple molds can be created in-house, we can respond quickly even for special shapes. Additionally, by converting processes for crushing, counterboring, and chamfering to cutting processing, molds become unnecessary, allowing for cost reduction. 【Features】 ■ Blank processing can be selected from different features: laser, wire, and punch. ■ Supports plate thickness up to t3.0 (C1100-1/4H and C1020-1/2H are available as standard stock materials). ■ Simple molds can be created in-house, allowing for short delivery times even for special shapes, such as low-height step bending, tip crushing, and special bending that is difficult with standard types. ■ Crushing, counterboring, and chamfering can also be handled with cutting processing without molds for short delivery times, converting processes for chamfering, countersinking, and extensive crushing to cutting processing. *For more details, please refer to the PDF document or feel free to contact us.

Processing Contract