To fully harness the advantages of 5G, materials with low dielectric constant and low dielectric loss are essential to suppress the decrease in transmission speed!
"AEROSIL Fumed Silica" is a high-performance resin filler that achieves low dielectric constant (Dk) and low dielectric loss tangent (Df). By imparting functionality through surface treatment, it enables control of moisture absorption, electrical properties, and rheological properties when used in PCBs (printed circuit boards) and CCLs (copper-clad laminates) for 5G applications. If you are interested in technical data regarding electrical properties, please feel free to contact us individually. 【Features】 ■ Achieves low dielectric constant (Dk) and low dielectric loss tangent (Df) ■ High-performance resin filler ■ Imparts functionality through surface treatment ■ Enables control of moisture absorption, electrical properties, and rheological properties when used in PCBs (printed circuit boards) and CCLs (copper-clad laminates) for 5G applications *For more details, please refer to the PDF materials or feel free to contact us.
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【Purpose】 ■Achieving low dielectric constant (Dk) and low dielectric loss tangent (Df) *For more details, please refer to the PDF document or feel free to contact us.
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Our company is one of the world's top specialty chemical companies. While we do not manufacture car tires, mattresses, medicines, or livestock feed, our products significantly enhance the performance of these items. With the power of specialty chemicals, we improve tire fuel efficiency, make mattresses more resilient, enhance the effectiveness of medicines, and make livestock feed healthier. Please feel free to contact us if you have any inquiries.