Canceling the thermal expansion of resin! A material developed in academia that solves dimensional deviations, warping, and characteristic changes in precision assembly products.
"BNFO (Bismuth-Nickel-Iron Oxide)" is a perovskite-type oxide material that exhibits an enormous negative linear thermal expansion of minus 187 per million for each degree of temperature increase. 【Technical Overview and Features】 It is a filler that suppresses the thermal expansion of components when compounded with resin. It has a significant thermal expansion suppression effect and allows for flexible control of the operating temperature range. It possesses negative thermal expansion characteristics that are 4 to 5 times greater than those of commercially available products from other companies. 【Applications of the Product and Technology】 It can be applied to adhesives for precision parts and injection molding. It is compounded and molded with epoxy, acrylic, silicone, and engineering plastics, and numerous expansion suppression effects have been confirmed. 【Benefits for Users】 It is expected to support high-density integration, expand the processing temperature range, improve dimensional accuracy, stabilize high-temperature characteristics, reduce warping, and enhance adhesion and flexibility by reducing the amount of filler used. *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Physical Properties (Partial)】 ■Specific Gravity: 9.04 ■Average Particle Size (D50): 3μm-5μm ■Chlorine Content: <100ppm ■Electrical Resistance (RT/100℃): 5.04/0.03 Ωcm ■Thermal Resistance (0℃/RT): 0.2/1.1 W/km ■Relative Permittivity (10MHz): 118 ■Dielectric Loss Tangent (10MHz): 1.25 *For more details, please refer to the PDF document or feel free to contact us.
Price information
Please contact us.
Delivery Time
※Please contact us as the delivery time varies depending on the quantity.
Applications/Examples of results
【Applications】 It is widely considered for applications where control of thermal expansion with composites of resin is desired. Particularly common cases under consideration include: - Additives for adhesives used in precision parts - Additives for injection-molded parts Please refer to the PDF materials for more details or feel free to contact us.
Company information
Our company leverages the management freedom and speed unique to independent startups to commercialize material technologies that society needs, regardless of the scale of the business. By continuously driving a grassroots revolution in material technology, we contribute to the accelerated evolution of technology and the sustainable development of humanity in the face of global social issues.
![Basic Knowledge: Comparison of Physical Properties of Lepcomica and Other Inorganic Fillers [Study Edition]](https://image.mono.ipros.com/public/product/image/b1c/2000662759/IPROS19649013952688266140.png?w=280&h=280)
![Product: Color Mica MILIOS (Milios) [Flaky Filler]](https://image.mono.ipros.com/public/product/image/840/2000589020/IPROS64333627599249924339.png?w=280&h=280)
![Nanotech2026 [December] Heat-dissipating filler spherical silicon carbide](https://image.mono.ipros.com/public/product/image/2046883/IPROS12594970993069549397.png?w=280&h=280)
![Nanotech2026 [December] Heat-dissipating filler round bar-shaped zinc oxide](https://image.mono.ipros.com/public/product/image/2046883/IPROS6063037862346935270.png?w=280&h=280)
