What is the semiconductor manufacturing process? An introduction to surface treatment that supports semiconductor manufacturing.

What is the semiconductor manufacturing process? This introduces the surface treatments used in semiconductor manufacturing equipment.

The semiconductor manufacturing process refers to a series of steps involved in designing, producing, and shipping semiconductor devices. Semiconductor devices are essential components used in various modern electronic devices such as computers, smartphones, automotive electronics, and LEDs. The semiconductor manufacturing process requires high purity and precision technology, and is often conducted in automated clean rooms. 1. Design → Photomask production Logic circuit design, layout design, photomask production 2. Front-end process (wafer processing) Procurement of silicon wafers → Cleaning → Film deposition → Photolithography → Ion implantation → Wiring → Inspection 3. Back-end process (assembly) Dicing → Die bonding → Wire bonding → Encapsulation → Solder ball mounting → Separation → Stamping → Inspection → Packaging and shipping In the semiconductor manufacturing process, especially in the front-end process, a high level of precision at the nano level is required, necessitating high purity and precision. Surface treatments, including fluororesin coating, support semiconductor manufacturing and play a significant role in semiconductor manufacturing equipment, an area in which Japan excels. Below, we will introduce surface treatments that are indispensable in semiconductor manufacturing.

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