Gelest PP2-TC03 is a two-component silicone thermal gap filler.
• Thermal conductivity • Soft and easily compressible • High tensile strength • Non-flowing thermosetting silicone • No by-products generated during curing • Addition reaction with platinum catalyst
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basic information
Gelest PP2-TC03 is a two-component silicone thermal gap filler. It has excellent thermal conductivity and efficiently transfers heat from electronic components to heat sinks. It has a certain degree of adhesion, but if adhesion to the substrate is required, a primer should be used for bonding.
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Applications/Examples of results
Applications • Heat dissipation for electronic devices and battery modules • High-power electronic devices • Formation of thermal conductive layers on-site • Flexible electronics
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