Adapted for high heat resistance! We provide liquid formulation materials used in power modules and more.
"VX-3657A/B" is a liquid epoxy resin formulation designed to meet the high heat resistance requirements associated with the advancement and miniaturization of electronic products. Due to its characteristics of high heat resistance, high fluidity, and low stress, it is applicable in power modules and similar applications. Additionally, because of its low linear expansion and low shrinkage rate, it is also used for high heat-resistant substrate encapsulation. 【Physical Property Data (Partial)】 ■ Curing Conditions ・100℃×1h + 180℃×2h ■ Glass Transition Temperature ・200℃ ■ Linear Expansion Coefficient α1 ・14ppm *For more details, please refer to the PDF document or feel free to contact us.
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【Other Physical Property Data】 ■Bending Strength ・102 MPa (23℃) ■Bending Elastic Modulus ・15 GPa (23℃) ■Dielectric Breakdown Strength ・20 MV/m (23℃) *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■ Power module ■ High heat-resistant substrate encapsulation *For more details, please refer to the PDF document or feel free to contact us.
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Our company takes pride in our technology that allows us to create products that can finely respond to the diverse needs of our customers in the field of thermosetting resins, and we are continuously engaged in research and development. Specifically, we focus on thermosetting liquid formulations and high-performance thermosetting resin molding materials as our core business, striving to thoroughly pursue market needs while aiming for research and development of new technologies that will serve as a foundation for anticipated trends. Please feel free to contact us if you have any inquiries.