Wafer processing contract service
- Back grinding processing - Laser grooving / dicing processing with blades - Rib cutting of TAIKO*1 wafers - We can also handle bare die shipping and package assembly. - You can also choose the shipping method. (Tray, dicing tape, embossed tape (reel) packaging, etc.) If you have any concerns, please feel free to contact us. *1 TAIKO is a registered trademark of Disco Corporation. TAIKO Process The "TAIKO Process" is a technology that differs from conventional back grinding. When grinding the wafer, it leaves the edge portion of the outer circumference (about 3 mm) intact and only grinds the inner circumference to reduce thickness. The introduction of this technology reduces the transport risk of thin wafers and minimizes warping. (Refer to https://www.disco.co.jp/jp/solution/library/grinder/taiko_process.html)
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basic information
Available wafer diameters: 6 to 12 inches (TAIKO*1 is only 8 inches). Please feel free to consult us for other inquiries.
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Company information
Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.