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  6. McDermid Low Melting Point Solder HRL1-OM550 SDGs

McDermid Low Melting Point Solder HRL1-OM550 SDGs

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McDermid Performance Solutions Japan Co., Ltd. HRL1 OM-550

last updated:Sep 26, 2025

セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)
セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)
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Introducing examples of achieving energy savings and cost reduction with low melting point solder! Contributing to carbon neutrality by reducing CO2 emissions! Impact resistance equivalent to SAC305!

HRL1 OM-550 is a low-melting-point solder paste designed to improve yield and reduce component warpage. It significantly enhances drop impact resistance and thermal cycling resistance compared to the company's conventional products. Its melting point is considerably lower than that of SAC305, achieving energy savings in the assembly process by lowering the peak reflow temperature from 245°C to 185°C. <Significant Improvement in Reliability> ● The reliability of HRL1 OM-550 has been significantly improved compared to the company's conventional low-melting-point solder, exhibiting performance close to that of SAC305. ● The drop impact test performance at the SAC series BGA ball joints shows significant improvement compared to the company's conventional low-melting-point solder. ● The thermal cycling test performance at the SAC series BGA ball joints shows significant improvement compared to the company's conventional low-melting-point solder. ● The HRL1 alloy is more suitable as a replacement for SAC series alloys compared to the company's conventional low-melting-point solder.

    Solder
低融点SP6.png

McDermid Low Melting Point Solder HRL1-OM550 SDGs

低融点SP6.png
低融点SP6.png 画像1.png スクリーンショット 2024-01-18 132901.png スクリーンショット 2024-01-18 132925.png
  • Seiwa Co., Ltd. - MPSJ Introduction Page
  • Special site - Product/service details - https://pr.mono.ipros.com/seiwa-tr/product/

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<Printing Process> - Micro-printability: φ180um (when using a metal mask with t=100um) φ250um (when using a metal mask with t=125-130um) - Lifespan on the plate: Over 12 hours - Usable printing speed: 25mm to 150mm/sec <Reflow Process Yield> - Reflow atmosphere: Air and N2 - Low voids: Meets IPC 7095 CLASS III - Reduced mounting defects: Meets industry recommended standards - Reduced macro (H.I.P) defects: High resistance to macro (H.I.P) and NWO (Non-Wet Open) defects - NWO (Non-Wet Open): High resistance to NWO (Non-Wet Open) defects - Flux residue: Pin testable - Micro-melting capability: Supports up to φ180um - Flux residue color: Transparent <Electrical Reliability> - SIR: Meets IPC SIR J-STD-004B & BELLCORE SIR - Flux classification: ROL0 (Halide-free) <Environmental Compliance> - Halogen content: Zero halogen

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Applications/Examples of results

Implementation of various electrical and electronic components.

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McDermid Low Melting Point Solder Paste HRL1 OM-550

McDermid Low Melting Point Solder Paste HRL1 OM-550

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セイワ

セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)

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The development of electronics has given people great dreams and has turned those dreams into reality, one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and delighted to have been able to engage in work that contributes to this segment of the electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can help realize humanity's great dreams and support the product and information development of our clients. I am committed to walking alongside our clients and growing together in the information society of the 21st century. However, on the other hand, global environmental issues have become increasingly prominent. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental value of humanity. I am determined to strive towards becoming a company that harmonizes with nature and society as we move towards an endless future.

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