Wafers and plates! We support various processing such as slicing, chamfering, notching, threading, and dicing.
We would like to introduce the "Silicon (Single Crystal & Polycrystalline)" that we handle. "Wafers" are available from φ1 inch, while "Ingots" and "Plates" can be provided up to φ18 inches. "Targets" can be customized to your desired shape. Additionally, we offer "shape processing" such as slicing, chamfering, notching, threading, and dicing, as well as "surface processing" including BG, lapping, and polishing. 【Product Lineup & Processing Details】 ■ Wafers: from φ1 inch ■ Ingots: up to φ18 inches ■ Plates: up to φ18 inches ■ Targets: customizable shapes ■ Shape Processing: various processes including slicing, chamfering, notching, threading, and dicing ■ Surface Processing: BG, lapping, polishing, and more *For more details, please refer to the PDF document or feel free to contact us.
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TECOM Corporation supplies and processes advanced materials and optical materials. We contribute to the creation of a society that reduces the burden on the global environment through advanced materials and technology, engaging in Japan's manufacturing. In addition to high-precision processed products such as sapphire, silicon, optical crystals, and optical glass, we also handle bandpass filters and optical mirrors.