Produced while suppressing warping and distortion in the finish! Depending on your request, partial black dyeing can also be accommodated.
Etched products are used as light shields (aperture plates) for built-in camera modules in smartphones and mobile phones. To absorb light, they are generally black in appearance. There are also specifications that stack multiple plates to allow for fine adjustments of hole sizes. The holes are usually circular, but can also be of irregular shapes. However, with Hirai Precision Industry's etching process, it is possible to easily create irregular shapes. **Advantages of creating apertures through etching:** - Compared to machining (laser processing, wire electrical discharge machining, cutting), etching can produce parts with reduced warping and distortion. - It can process thin foils with a thickness of 0.005mm. - Not only etching, but also black surface treatment can be processed and delivered consistently. *For more details, please refer to the PDF document or feel free to contact us.*
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[Regarding Black Processing] ■ Hirai Precision Industry is capable of performing and providing black dyeing processing. ■ For Cu (copper) materials, it is possible to perform black processing in their raw material state. ■ In the case of SUS (stainless steel), black dyeing processing is done after copper plating. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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With a motto of small lots, diverse varieties, and short delivery times, we provide high-quality products through a consistent production system from prototype processing to mass production. We offer various proposals from the development stage of semiconductor packages and meet the needs of over 1,000 customers both domestically and internationally through precision processing technology. We aim to be a "department store of processing technology" that can handle all precision processing, primarily focusing on etching, including essential transport tools and carriers used in the manufacturing processes of semiconductors and electronic components.