With fine etching processing, it is possible to reproduce metal foreign substances (contaminants) in arbitrary shapes!
Hirai Precision Industries' etching process uses a film or glass plate known as a master plate for processing. Therefore, even if the requested size of the design drawn on the plate is a small shape, it is possible to carry out the processing. Taking advantage of that feature, there are also requests to intentionally create metal foreign objects (contaminants). This serves the purpose of evaluating the removal of foreign objects that may occur during manufacturing. [Case Overview] ■ Product Shape: Individual numbers from 0 to 9 ■ Material: SUS304-CSP-H ■ Plate Thickness: 0.01t ■ Minimum Residual Width: 0.05mm ■ Minimum Cutting Width: 0.05mm ■ Comparison Object: 0.5mm wide mechanical pencil lead *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Expected Use Cases】 ■ As well-defined fine foreign substances (contaminants) ■ Sample use for appearance inspection tests of image measurement devices *For more details, please refer to the PDF document or feel free to contact us.
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With a motto of small lots, diverse varieties, and short delivery times, we provide high-quality products through a consistent production system from prototype processing to mass production. We offer various proposals from the development stage of semiconductor packages and meet the needs of over 1,000 customers both domestically and internationally through precision processing technology. We aim to be a "department store of processing technology" that can handle all precision processing, primarily focusing on etching, including essential transport tools and carriers used in the manufacturing processes of semiconductors and electronic components.
![[Processing Example] Etching Processing Mirror Material](https://image.mono.ipros.com/public/product/image/e28/2000850437/IPROS36434547853852429383.jpeg?w=280&h=280)
![[Processing Example] Power Semiconductor (Power Device) Etching Processing](https://image.mono.ipros.com/public/product/image/d95/2000850621/IPROS44658195744487621775.jpeg?w=280&h=280)
![[Processing Example] Regarding the Fine Residual Width in Etching Processing](https://image.mono.ipros.com/public/product/image/112/2000850802/IPROS77442332386063106799.jpeg?w=280&h=280)
![[Processing Example] Etching Process Seal Ring Cap](https://image.mono.ipros.com/public/product/image/7f5/2000850843/IPROS66548720046618811379.png?w=280&h=280)
![[Processing Example] Etching Processing - Thickness Adjustment of Material - Reducing Plate Thickness](https://image.mono.ipros.com/public/product/image/df2/2001073708/IPROS83291001823520850155.jpeg?w=280&h=280)
![[Granulation, Mixing, etc.] Contract processing of powder processing and liquid powdering.](https://image.mono.ipros.com/public/product/image/2116367/IPROS17513563481775682033.png?w=280&h=280)