Achieved improvements in the joining process through a simple ACF implementation experiment.
We offer a "Simple ACF (Anisotropic Conductive Film) Implementation Experiment Service." ACF is a material in which metal particles or tiny resin beads are metallized and dispersed within a resin film as a conductive material. It is a bonding material that achieves electrical connections with narrow pitch by applying pressure and heat. It is necessary to place the ACF between the substrate and the bonding target, applying horizontal pressure while simultaneously heating. Although it is a jig-level device, we are conducting experiments.
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Flip chip bonding experiment.
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We assist those involved in the research and development of semiconductor devices and related materials as their hands and feet in solving problems. (1) Problem-Solving Support Services Research and development itself is the main theme of problem-solving. We leverage our experience from over 10,000 related prototypes to conduct investigations, analyses, and propose experiments. (2) Electronic Component Processing Services Especially for sensors, there are many irregular shapes that are difficult to accommodate with dedicated equipment. In cases of small quantities, investment balance can be an issue that prevents starting. We can propose production with minimal investment based on our experience in prototype support. We also provide support for small quantities until customers establish dedicated lines. (3) Prototype-Related Tool and Equipment Development Services At the beginning of semiconductor-related material development, there is a need to create devices and tools for functional evaluation. In most cases, dedicated evaluation devices exist, but they are multifunctional and expensive. You can utilize our services when a simple device for single-function comparative evaluation is needed in the early stages of development. We have a track record for applications such as sheet-related materials, package resins, encapsulation resins, phosphors, and QDs.