佐用精機製作所

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佐用精機製作所 Company Profile
We are supporters of semiconductor-related development.
We assist those involved in the research and development of semiconductor devices and related materials as their hands and feet in solving problems. (1) Problem-Solving Support Services Research and development itself is the main theme of problem-solving. We leverage our experience from over 10,000 related prototypes to conduct investigations, analyses, and propose experiments. (2) Electronic Component Processing Services Especially for sensors, there are many irregular shapes that are difficult to accommodate with dedicated equipment. In cases of small quantities, investment balance can be an issue that prevents starting. We can propose production with minimal investment based on our experience in prototype support. We also provide support for small quantities until customers establish dedicated lines. (3) Prototype-Related Tool and Equipment Development Services At the beginning of semiconductor-related material development, there is a need to create devices and tools for functional evaluation. In most cases, dedicated evaluation devices exist, but they are multifunctional and expensive. You can utilize our services when a simple device for single-function comparative evaluation is needed in the early stages of development. We have a track record for applications such as sheet-related materials, package resins, encapsulation resins, phosphors, and QDs.

Business Activities
Related semiconductor products with a track record in various services < Laser > VCSEL (Vertical-Cavity Surface-Emitting Laser) Frame Laser Canstem Laser < LED Lamp > Red Blue Green White Full Color Infrared Canstem LED UV LED High Brightness LED Multi-Wavelength LED < LED Display > Line Light Source Dot Matrix Monolithic Array LED Printer Head White LED 7-Segment LED Power LED Visible Light LED Infrared LED UV LED Array MINI LED Array < Microwave Devices > Pill-Type Schottky Barrier Diode VCO Module Microwave Sensor < Sensors > Magnetic Sensor Temperature Sensor Acceleration Sensor Infrared Sensor Pressure Sensor Photo Sensor Flow Sensor < Light Receiving Elements, etc. > Light Receiving Element Array Light Receiving and Emitting Element Module < Methods > Ag Paste Bonding Gold-Tin (AuSn) Bonding Bump Bonding Solder Bonding Thermal Compression Adhesive Hermetic Seal Reflow Solder Reflow Phosphor Coating ACP Bonding ACF Bonding Transfer Molding Resin Mold Molding
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Detailed information
Company name | 佐用精機製作所 |
---|---|
number of employees | 15 |
Contact address | postalcode 679-5307 Hyogo/ Sayo-cho, Sayo-gun/ Enouji 222View on map TEL:0790-82-2227 FAX:0790-82-3824 |
Key Partners | Ushio Electric Co., Ltd. SCREEN Holdings Co., Ltd. Kodenji Co., Ltd. Phoenix Electric Co., Ltd. Panasonic Corporation Idea System Co., Ltd. Other major listed companies related to research and development: 950 companies with transaction records. |
Industry | Electronic Components and Semiconductors |
