Equipped with 11th/10th generation Core i9/i7/i5/i3 CPUs, PCIe 3.0 [x8] x 2, PCIe 3.0 [x4] x 2.
【IEI FLEX-BX210-Q470 Features】 ■ Width 357 × Height 88 × Depth 230 mm, 7.23 liters ■ 11th/10th generation Core i9/i7/i5/i3 CPU ■ PCIe 3.0 [x8] x 2, PCIe 3.0 [x4] x 2 ■ 2.5" SATA HDD bays (Hot-Swappable) x 4 ■ M.2 2280 (supports PCIe Gen 3.0 x4 NVMe SSD) x 1
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basic information
Specifications ■CPU: 11th/10th Generation Socket LGA1200 Core i9/i7/i5/i3 ■Chipset: Q470/Q470E ■Memory: 288pin DDR4 2933/2666 MHz U-DIMM x 2 (up to 64GB) ■Storage: 2.5" SATA HDD bays x 4 ■Expansion Slots: PCIe3.0[x8] x 2, PCIe3.0[x4] x 2 (Supported size: 68 x 167mm (maximum)) M.2 3042/3052 B-Key x 1, M.2 2280 M-key x 1, M.2 2230 A-key x 1 ■I/O Connectors: 2.5GbE x 3 (RJ-45), USB3.2 x 6, RS-232 x 2, HDMI x 1, DP x 1, Audio Mic In / Line out ■Input Power: ATX 350W AC input 90~264V ■Weight: 4.1 kg ■Operating Temperature: -10 to 50℃ (Extended temperature when using SSD) ■Shock: 10G (11ms) ■Vibration: 1.5G ■Certification: CE/FCC
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Applications/Examples of results
Factory and Building Automation / Multimedia Systems / Digital Signage
Line up（5）
| Model number | overview |
|---|---|
| FLEX-BX210-Q470/35-R20 | 11th/10th generation socket LGA1200 barebone supporting Core i9/i7/i5/i3 CPUs, Q470 chipset, 350W PSU |
| FLEX-BX210-Q470-i3C-R20 | Core i3-10320 3.8GHz, 8GB DDR4, 350W PSU |
| FLEX-BX210-Q470-i5C-R20 | Core i5-10500TE 2.3GHz, 8GB DDR4, 350W PSU |
| FLEX-BX210-Q470-i7D-R20 | Core i7-10700TE 2.0GHz, 16GB DDR4, TPM 2.0, 350W PSU |
| FLEX-BX210-Q470-i9D-R20 | Core i9-10900TE 1.8GHz, 16GB DDR4, 350W PSU |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.