Generally, high multilayer stacking technology is adopted in manufacturing.
Number of layers: 12 layers Material: FR4 TG175 Board thickness: 2.0 +/- 10% mm Surface treatment: Electroless nickel/electroless gold plating Copper foil thickness: H/1/1/1/1H OZ Remark: Blind holes: L1/L2 & blind holes
Inquire About This Product
basic information
Increase the wiring area and enhance the wiring density. Reduce the thickness of the insulating medium to decrease the overall thickness and weight of the printed circuit board. Shorten the length of wire interconnections to reduce electrical signal interference and loss. The relatively small thickness of the vias improves the reliability of the interconnections. The structural design of the vias is convenient, allowing for greater design flexibility and improved design efficiency.
Price range
Delivery Time
Applications/Examples of results
These include laptop computers and tablet computers, automotive electronics, aerospace, medical devices, wearable electronics, robots, and smart devices.
Company information
Our company, ExPlus, was established in Taiwan in 1997 and is a specialized manufacturer focusing on printed circuit boards.
