The functions of electronic devices are becoming increasingly complex, and their sizes are getting smaller. If you need multilayer substrates, please consult us here.
Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.
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basic information
Number of layers: Four layers Material: FR-4 Board thickness: 0.6 +/- 0.1 mm Surface treatment: Electroless gold plating 2 µ" Copper foil thickness: 1/H/H/1 OZ Remark/Impedance control - 50 OHM Differential pair - 90 OHM/Edge through hole
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Applications/Examples of results
This is our project.
Company information
Our company, ExPlus, was established in Taiwan in 1997 and is a specialized manufacturer focusing on printed circuit boards.
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