Explaining the basics of "BGA," "reflow," "REACH regulations," and "RoHS directive" in an easy-to-understand manner, which you might be hesitant to ask about now!
With over 30 years of experience in the industry, K-All has consistently been involved in PCB assembly and has numerous achievements in reballing and reworking high-difficulty "underfill BGA." We provide a clear explanation of the fundamental knowledge of PCB assembly! We explain various terms, including "BGA," "CSP," "spectroscopic analysis equipment," "Vickers hardness," and "flow characteristics." We encourage you to read it. **Contents (partial)** ■ ABC: BGA/CSP/DIP/IPC standards/JIS standards/LGA ■ A section: Printability/Whisker/Wafer Level CSP/Liquid Phase Line Temperature ■ K section: PCB cleaning/Capillary Ball/Aggregation Force/Eutectic Solder ■ S section: Side Ball/Oxides/Initial Wettability/Squeegee ■ T section: Heat Resistance/Chip Stand/Claw/De-wetting/Dispenser ■ N section: Lead-free/Wettability/Adhesive Retention Time *For more details, please refer to the PDF document or feel free to contact us.*
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Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.