Ultrasonic flaw detection inspection that allows for internal inspections that are not visible, such as in assembly processes.
Ultrasonic unit × conveyor! Usable for internal detection of metal parts, as well as semiconductors and electronic components.
Our company is able to detect internal defects in products that cannot be identified through image inspection alone by using ultrasonic units. For example, in the assembly process of printed circuit boards, continuity tests are conducted, but it is often not possible to actually check the internal conditions. In this regard, by using ultrasonic flaw detectors, we can visualize the internal conditions through signals, recognize the current state, and conduct inspections and quality control based on that. This technology can also be utilized for internal detection of semiconductor and electronic components, as well as metal parts, and we propose automation using ultrasonic units combined with conveyors. [Reasons to Choose Takaki Seisakusho Co., Ltd.] - A robust development and design system with over 10 electrical and mechanical designers - Various transport units such as loaders and unloaders are also provided - We propose various inspection methods including image inspection (cameras) and ultrasonic flaw detectors *For more details, please refer to the PDF materials or feel free to contact us.
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Our company is engaged in the production of transport carts used in semiconductor factories, as well as assembly and inspection work for semiconductors. At the same time, we strive for technological innovation, and currently, our main business includes the manufacturing and sales of multifunctional taping machines and other semiconductor back-end equipment, as well as various precision sheet metal processing and machining. Moving forward, we will continue to respond swiftly to our customers' diverse needs, with the motto of "good products, at lower prices, faster," and all employees will work together day and night on research and development of technology.